K3s, a lightweight and highly available certified Kubernetes distribution, has released version v1.28.3+k3s2. This version is designed for production workloads in resource-constrained and remote locations, as well as inside IoT appliances. K3s comes as a single binary that is less than 70MB in size, making it easy to install, run, and auto-update a production Kubernetes cluster.

The latest release updates Kubernetes to version v1.28.3 and addresses several issues. Some of the changes since v1.28.3+k3s1 include:

• Restoration of selinux context systemd unit file
• Update of channel to v1.27.7+k3s1
• Bump of Sonobuoy version
• Bump of Trivy version
• Fix for accessing outer scope .SystemdCgroup, which resolves issues with starting with nvidia-container-runtime
• Upgrade of traefik chart to v25.0.0
• Update of traefik to fix registry value
• Improvement to not use iptables-save/iptables-restore if it will corrupt rules

The components and versions included in this release are as follows:

• Kubernetes v1.28.3
• Kine v0.10.3
• SQLite 3.42.0
• Etcd v3.5.9-k3s1
• Containerd v1.7.7-k3s1
• Runc v1.1.8
• Flannel v0.22.2
• Metrics-server v0.6.3
• Traefik v2.10.5
• CoreDNS v1.10.1
• Helm-controller v0.15.4
• Local-path-provisioner v0.0.24

For more information on the release and its features, refer to the Kubernetes release notes.

Overall, this new release of K3s brings important updates and fixes to enhance the performance and reliability of Kubernetes clusters in production environments.

Source: K3s

Netgate has announced the Release Candidate (RC) of pfSense CE software version 2.7.1. This open-source project, supported by Netgate since 2008, is a widely-used firewall and routing platform. The RC release is an opportunity for users to try out the new version and provide feedback.

The major changes and features in pfSense CE software version 2.7.1 include:

1. Upgraded OpenSSL to version 3.0.12: This upgrade was necessary as OpenSSL 1.1.1 has reached its End of Life and will no longer receive security patches. The upgrade removes older and weaker encryption and hash algorithms, improving security.

2. Kea DHCP added as an opt-in feature: The Kea DHCP server is now available as an optional feature. While it is not feature complete in this version, users can switch to Kea DHCP by navigating to the System > Advanced menu and changing the DHCP Options to “Kea DHCP”. However, switching to Kea DHCP may result in the ignoring of assigned hostnames and dynamic lease registration in DNS.

3. Improved support for SCTP: Support for SCTP in firewall rules, NAT, and logging has been enhanced. Users can now filter SCTP packets by port number, in addition to source and destination address.

4. IPv6 Router Configuration moved: The IPv6 Router Advertisement configuration has been relocated to Services > Router Advertisement as part of the integration with the Kea DHCP server.

Other changes in this release include upgrading PHP to version 8.2.11, upgrading the base operating system to a more recent point of FreeBSD 14-CURRENT, and addressing various bugs and issues.

Testing of the RC software release is crucial to ensure its reliability and robustness for all users. Netgate encourages users to download and test the release candidate, and provide feedback on any issues they encounter.

To install the upgrade, users can follow the detailed Upgrade Guide available in the pfSense documentation. It is recommended to back up the pfSense CE configuration prior to the upgrade. The upgrade can be performed through the web interface by navigating to System > Update and setting the Branch to “Next Stable Version (2.7.1-RC)”.

OpenZFS, the popular file system for Linux servers and home labs, has received a significant performance enhancement. The new feature improves write performance scalability by allowing parallel syncing of multiple datasets/objects and reducing locking contention.

This optimization was developed by Brian Behlendorf from the Lawrence Livermore National Laboratory (LLNL) over the summer. Tests conducted on an AMD EPYC server running OpenZFS showed a remarkable improvement in write bandwidth. The write performance increased from 1328MB/s to 2495MB/s, as reported by the developer. Another developer also observed a significant boost in FIO write bandwidth, jumping from 1386MB/s to 2449MB/s.

In addition to the substantial increase in write performance, the new feature also reduces locking contention. This improvement further enhances the overall efficiency of OpenZFS.

The ZFS sync parallelism for OpenZFS has been merged into the Git repository, as announced in the recent pull request. Detailed information about this enhancement can be found in the pull request link provided.

This update is a significant milestone for OpenZFS users, as it greatly enhances write performance scalability and improves the overall efficiency of the file system. The optimization is expected to benefit users in various scenarios, from Linux servers to home labs and DevOps environments.

Source: Phoronix.

Formnext 2023 is approaching, and Prusa3D is excited to showcase their industrial 3D printers under the Prusa Pro brand at the event. While Prusa Research remains committed to their current line of products, the expansion into industrial additive manufacturing makes sense for the company.

The Prusa Pro line of industrial machines incorporates the latest technologies developed by Prusa3D. These machines feature a range of advanced features, including a heated chamber, ultralight print heads made of duralumin, automated print collection, image recognition, high-pressure turbine cooling, 500 °C print heads, 48V motors, and automatic resin handling. These advancements in the Prusa Pro line have a positive influence on the technology used in their other products.

In turn, the Prusa Pro machines benefit from the feedback and expertise gained from the hundreds of thousands of Original Prusa printers in use worldwide. The Prusa Pro line aims to provide the same ease of use as their other printers, with features such as removable print sheets, automated calibrations, and fine-tuned profiles in PrusaSlicer. Additionally, the Prusa Pro line is compatible with third-party materials, ensuring no vendor lock-in.

The Prusa Pro product line operates as a separate, independent team within Prusa Research. The team has been in operation for over four years and includes specialists hired specifically for this branch of the company, as well as developers from the acquired companies FUTUR3D and TRILAB. The Prusa Pro team has its own manufacturing capacity, either in a separate building or even in another town, to ensure the continued production of the popular Original Prusa printers.

At Formnext 2023, Prusa3D will be showcasing three brand-new machines from the Prusa Pro line. The Prusa Pro HT90 is a large format, industrial delta kinematics 3D printer with an actively heated chamber capable of reaching up to 90 °C, closed-loop HEPA filtration, and a nozzle temperature of up to 500 °C. It is suitable for printing high-temp materials like PCCF or PA11CF and offers fast printing for materials like PLA, PETG, and ABS.

The Prusa Pro SLX is a concept for their future MSLA 3D printer. It features a 12K MONO LCD panel for ultra-fine printing, a vat tilting mechanism for fast layer transitions, and automated material handling. The Prusa Pro SLX has several features not currently available on other SLA printers on the market.

The Prusa Pro AFS, the latest iteration of their Automatic Farm System, will also be showcased at Formnext. The AFS includes an Intelligent Shelving System that moves print sheets to a modular shelving system after printing, ensuring efficient storage. It also features an optical monitoring system with image recognition for automatic print issue detection. The AFS is powered by Prusa Connect, their internally-made farm management system.

In addition to these machines, Prusa3D will also be displaying the Prusa Pro Medical One, their certified SLA printer for biocompatible resins, which is now integrated into Exocad, a leading CAD software for digital dentistry.

For those unable to attend Formnext, Prusa3D offers the option to schedule a call with their sales team to learn more about the Prusa Pro HT90, AFS, SLX, and other products. They have provided price quote forms for each machine on their website.

Formnext attendees can find Prusa3D’s booth in hall 12.1, booth G39. In addition to the new machines, visitors can also see the XL printer, including a prototype enclosure, the MK4, MINI+, and new recycled Prusament colors. And for those interested, there will be beer available at the booth.

EDATEC has released two fanless cases for the Raspberry Pi 5 single-board computer (SBC), filling the gap for official fanless cases for this latest SBC. The two cases, ED-Pi5Case-B and ED-Pi5Case-O, offer different designs and cooling solutions.

Both cases are made of aluminum and are available in either silver or black. They provide easy access to all ports and interfaces of the Raspberry Pi 5, including the GPIO header, MIPI connectors, PCIe FPC connector, and PoE header. However, the closed enclosure blocks the battery and UART connectors, while both cases block the fan connector.

EDATEC claims that the ED-Pi5Case-B can reduce the temperature by 20 to 25°C, while the lighter ED-Pi5Case-O can reduce it by up to 15°C. Both cases come with three thermal pads to cover the Broadcom BCM2712 CPU, the wireless module, and the PMIC. They also add thermal conductive silicon on the bottom of the board.

The ED-Pi5Case-B features a low-profile, closed design with a small black plastic window on the top right for wireless connectivity. EDATEC states that this case benefits from strong WiFi and Bluetooth connectivity, enhanced by the semi-transparent wireless window. On the other hand, the ED-Pi5Case-O is an open case with two heatsinks placed on the top and bottom of the Raspberry Pi 5.

Source: CNX Software – Embedded Systems News.

MediaTek has taken a different approach with its new Dimensity 9300 processor by opting for “big” cores instead of the usual big.LITTLE technology that combines high-performance cores with energy-efficient cores. This decision could make the Dimensity 9300 more competitive with flagship-class processors from Qualcomm and other companies. The chip features four Cortex-X4 CPU cores and four Cortex-A720 cores, which could give it an edge in tasks that utilize all eight CPU cores simultaneously. However, it is important to note that the CPU frequencies differ between MediaTek’s chip and Qualcomm’s Snapdragon chip, which has one Cortex-X4 core and five Cortex-A720 cores. Additionally, without lower-power cores, the energy efficiency of Qualcomm’s chip remains to be seen.

Specifications:

• CPU:

  • MediaTek Dimensity 9300:
    • 1 x Cortex-X4 @ 3.25 GHz
    • 3 x Cortex-X4 @ 2.85 GHz
    • 4 x Cortex-A720 @ 2 GHz
  • Qualcomm Snapdragon 8 Gen 3:
    • 1 x Cortex-X4 @ 3.3 GHz
    • 3 x Cortex-A720 @ 3.2 GHz
    • 2 x Cortex-A720 @ 3 GHz
    • 2 x Cortex-A520 @ 2.3 GHz

• GPU:

  • MediaTek Dimensity 9300: Immoratlis G720-MC12
  • Qualcomm Snapdragon 8 Gen 3: Adreno 740

• RAM:

  • MediaTek Dimensity 9300: LPDDR5T (up to 9600 MB/s)
  • Qualcomm Snapdragon 8 Gen 3: LPDDR5x (up to 9600MB/s)

• Wireless:

  • MediaTek Dimensity 9300:
    • WiFi 7 (6.5 Gbps)
    • Bluetooth 5.4
    • 5G Sub-6 GHz/mmWave (up to 7.9 Gbps)
  • Qualcomm Snapdragon 8 Gen 3:
    • WiFi 7 (5.8 Gbps)
    • Bluetooth 5.4
    • 5G Sub-6 GHz/mmWave (up to 10 Gbps)

• Camera:

  • MediaTek Dimensity 9300:
    • Up to 320MP (single camera)
    • Up to 4K @ 60 fps (video)
    • Up to 8K @ 30 fps (video)
    • 18-bit ISP
  • Qualcomm Snapdragon 8 Gen 3:
    • Up to 200MP (single camera)
    • Up to 4K @ 120 fps (video)
    • Up to 8K @ 30 fps (video)
    • 18-bit ISP

• Display:

  • MediaTek Dimensity 9300:
    • Up to 4K @ 120 Hz
    • Up to WQHD @ 180 Hz
  • Qualcomm Snapdragon 8 Gen 3:
    • Up to 4K @ 60 Hz
    • Up to QHD+ @ 144 Hz

MediaTek claims that the Dimensity 9300 offers several improvements over its predecessor, the Dimensity 9200, including faster CPU and GPU performance, as well as improved AI performance.

Source: Liliputing.